Chassis Heatsinks
Finned 5.5", 7.5", 9.5", 11.5" Extrusion Heatsinks
PRODUCT INFORMATION
Parvus'
Chassis Heatsinks provide a thermally conductive aluminum surface for enclosed PC/104 and EBX embedded systems. With a high-finned protruding design, these extrusion heatsinks serve to increase the surface area of an enclosure housing, transferring potentially damaging heat away from a system and preventing performance degradation.
Available in standards lengths of 5.5", 7.5", 9.5", and 11.5" (custom sizes available), these 5.0" wide aluminum-alloy heatsinks can be used in conjunction with any of Parvus’ PC/104 and EBX Enclosure system, dissipating heat caused from power supplies, CPUs, and other embedded devices. These heatsinks can also be used in concert with Parvus’ PC/104 Fan Cards for a complete thermally managed environment.
While these heatsink plates are normally secured to an enclosure by placing screw holes in desired locations, custom heatsinks incorporating dovetailed grooves can also be designed, upon request. Custom lengths can also be ordered, upon request, to accommodate specific application requirements.